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FUJITSU SEMICONDUCTOR DATA SHEET
DS04-26903-3E
ASSP
CMOS
Dolby Digital (AC-3) Decoder LSI
MB86342B
s DESCRIPTION
Dolby Digital (AC-3) is a perceptual digital audio coding technique of unprecedented efficiency, quality and versatility. Fujitsu has developed Dolby Digital (AC-3) 5.1-ch full decodable LSI. This LSI is certificated as " Dolby Digital (AC-3) Decoder LSI " by Dolby Laboratories Licensing Corporation.
s FEATURES
* Dolby Digital (AC-3) 5.1ch Full Decode - All bit-rate and All sampling frequency - Down Mix - Dialog Normalization - Dynamic-range Compression - Noise sequencer (Test tone) - Each channel can be independently set - Output Bass Management (config-1, 2, 3) * Dolby Pro Logic Decode * Dolby Digital (AC-3) + Dolby Pro Logic Decode * 16/18/20bit Audio Data Input/Output
(Continued)
s PACKAGE
100-pin Plastic QFP
(FPT-100P-M06) Note: Dolby, AC-3, Pro Logic and double-D are trademarks of Dolby Laboratories Licensing Corporation.
MB86342B
(Continued) * Operat with only audio system clock (384fs) by built-in PLL * Correct with ADC,DAC,DIR and DIT with type audio I/F three lines * Control by Host I/F * 3.0V to 3.6V operation * QFP-100 pin package
s PIN ASSIGNMENT
(Top view)
D08 D07 V DD V SS D06 D05 D04 D03 D02 V SS D01 D00 ICCLK ICBRK ICD1 ICD0 ICS2 ICS1 ICS0 V SS
81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
D09 V SS V DD D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 A00 A01 V SS A02 A03 A04 A05 A06 A07 A08 A09 A10 A11 V SS V DD A12 A13
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
A14 A15 WE CS MOD BST HDOUT HDIN HCS HCLK V SS GP0 GP1 GP2 GP3 GP4 V SS V DD GP5 GP6
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XRST EXTIN V DD V SS MCLK1 MCLK2 KFSIO SCKO PM PSTOP EXLOCK MS FS1 FS2 V SS SYNC LRCKI1 BCKI1 SDI1 LRCKI2 BCKI2 SDI2 LRCKO BCKO SDO1 SDO2 SDO3 V DD V SS GP7
(FPT-100P- M06)
MB86342B
s PIN DESCRIPTION
Pin No. 5 6 1 8 12 16 2 13, 14 7 9 10 11 41 43 44 42 45 30 to 32, 35 to 39 17 18 20 21 19, 22 23 24 25 to 27 46 47 48 68 to 77,80 to 82 85 to 89, 91, 92 93 94 95, 96 97 to 99 Pin name MCLK1 MCLK2 XRST SCKO MS SYNC EXTIN FS1, FS2 KFSIO PM PSTOP EXLOCK HCLK HDIN HDOUT HCS BST GP0 to GP7 LRCKI1 BCKI1 LRCKI2 BCKI2 SD1, SD2 LRCKO BCKO SDO1 to SDO3 MOD CS WE I/O I I/O I O I I I I I/O I I I I I O I I I/O I/O I/O I I I O O O I O O O I/O O I I/O O Clock input Clock input/output Reset signal input System clock output Master/Slave select input L: Master (X'tal) H:Slave (external clock) Synchronous/Asynchronous select input System clock input (384fs) Sampling frequency switching signal input Audio input/output clock (384fs) Test pin (usually clipped to GND) PLL and crystal oscillator control signal Lock signal input of EXTIN Clock input for serial input-data of host interface Serial data input of host interface Serial data output of host interface Chip-select signal input of host interface Usually clipped to GND Input/output of 8-bit general port data Sampling clock input/output for audio interface serial data Bit clock input/output for audio interface serial data Sampling clock input for audio interface serial data Bit clock input for audio interface serial data Serial data input of audio interface Sampling clock output for audio interface serial data Bit clock output for audio interface serial data Serial data output of audio interface Bus-mode control signal input Chip-select signal output for external SRAM interface Write enable signal output for external SRAM interface Address data output of external SRAM interface Data input/output of external SRAM interface Clock output for emulator External break control signal input for emulator Input/output signal for data/address of emulator Status signal output for emulator 3 Function
49 to 52, 55 to 64, 66, 67 A00 to A15 D00 to D19 ICCLK ICBRK ICD0, ICD1 ICS0 to ICS2
MB86342B
s BLOCK DIAGRAM
B-bus A-bus
P-bus
MCLK1 XRST MS CLKGM KFSIO PSTOP SYNC
MCLK2 SCKO EXTLN PM FS2,FS1 EXLOCK
MCORE
ADIF
LRCKI2,LRCKI1 BCKI2,BCKI1 SDI2,SDI1 LRCKO BCKO SDO3 to 0
HCLK HISF HDOUT BST
HDIN HCS
GP
GP7 to 0
MEM EXMIF
MOD WE D19 to 00
CS A15 to 00
ICBRK EMUIF ICS2 to 0
ICCLK ICD1,ICD0
LOG
4
MB86342B
s FUNCTION OF EACH BLOCK
MCORE : MUCAP Core
MUCAP Core is a 20-bit fixed point DSP core. This core operates MOVE, BRANCH, INTERRUPT, ADDRESSING and ARITHMETIC operations.
CLKGM : Clock Generation Module
This module generates internal and external clock. two type of clocks are generated external clocks and clock from external crystal oscillator.
ADIF
: Audio Interface Module
This module is an interface of input/output serial audio data to external. * 2-channels of input port, and 3-channel of output port. * 2-audio data input registers and 6-output registers ( 20-bit ).
HSTIF
: Host Interface Module
This module transfers asynchronous serial data to host CPU, which has input data register and output data register(20-bit).
GP
: General Port Module
This module has a 8-bit direction register and 8-bit data register. Each port is independent as a 1pin input/output general port(total 8pins).
EXMIF
: External Memory Interface Module
This module reads and writes data to external memory(SRAM), which has 3-byte data read/ write mode and 1word(20bit) data read/write mode. This module uses in-service-register in order to read and write 3-byte data.
EMUIF
: Emulator Interface Module
This module is used for in circuit emulation.
LOG
: LOG Module
This module has registers to refer to table data for the operation of logarithmic functions.
MEM
: Memory Module
This module restores data and programs.
5
MB86342B
s ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Input voltage Output voltage Output current Storage temperature Overshoot Undershoot Symbol VDD VIN VOUT IOUT Tstg -- -- Condition Vss = 0V -- -- IOL = 4.0mA IOL = 8.0mA -- 50ns (Max.) 50ns (Max.) Rating Vss-0.5 to +4.0 Vss-0.5 to VDD+0.5 Vss-0.5 to VDD+0.5 14 -40 to +125 VDD+1.0 VDD+1.0 Unit V V V mA C V V
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings..
s RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage "H"-level input voltage "L"-level input voltage Operating temperature Symbol VDD VIH VIL Ta Value Min. 3.00 VDD x 0.7 VSS 0 Typ. 3.30 -- -- -- Max. 3.60 VDD VDD x 0.2 +70 Unit V V V C
WARNING: Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representative beforehand.
s ELECTRICAL CHARACTERISTICS
1. Input/Output Pin Capacitance
Parameter Input pin Output pin I/O pin IOL = 4mA 8mA IOL = 4mA 8mA Symbol CIN COUT CI/O (Ta = +25C, frequency = 1MHz) Requirements Unit Max.16 Max.16 Max.16 pF
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MB86342B
2. DC Characteristics
( VDD = 3.0 to 3.6V, Vss = 0V, Ta = 0 to +70C) Value Unit Min. Typ. Max. -- -- VDD x 0.7 Vss VDD-0.5 VSS -10 -10 -- Type/condition Output short-circuit current IO*3 Normal/IOL = 4mA Normal/IOL = 8mA 10 VO = VDD +40 +80 -- 160 -- -- -- -- -- -- 25 100 240 VDD VSS x 0.2 VDD 0.4 10 10 50 VO = 0V -40 -80 mA A mA V V V V A k
Parameter Power supply current "H"-level input voltage "L"-level input voltage "H"-level output voltage "L"-level output voltage Input leakage current *2 (Tri-state pin Input) Pull up/down resistance
Symbol IDDS IDD VIH VIL VOH VOL ILI ILZ RP
Condition Standby mode *1 Operating mode -- -- IOH = -4mA IOH = -8mA IOL = 4mA IOL = 8mA VI = 0-VDD
*1: VIH = VDD, VIL = VSS The memory is in the standby mode. *2: If an Input buffer with pull-up/-down resistor is used, the input leakage current may exceed the above value. *3: Maximum supply current at the short circuit of output VDD or VSS. For 1 second per LSI pin.
7
MB86342B
3. AC Characteristics
(1) EXTIN, SCKO, XRST
EXTIN KFSIO(lnput) (5)
(2) (3) (1) Tcyc (7)
(6)
XRST (4) SCKO KFSIO(Output) Note: Dotied line represents:
0.7 V DD 0.2 V DD
No. (1) (2) (3) (4) (5) (6) (7) (8) EXTIN cycle
Characteristics EXTIN "H" pulse width EXTIN "L" pulse width SCKO delay time XRST setup time XRST hold time XRST "L" pulse width PLL lock-up time
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit -- 0.4xTcyc 0.4xTcyc -- 6 3 * 100 Tcyc -- -- -- -- -- -- -- -- -- -- 11 -- -- -- -- ns ns ns ns ns ns ns s
* : EXTIN frequency EXTIN frequency Tcyc(ns) (MHz) 18.432 16.9344 12.288 54.253 59.0514 81.380
Clock mode Fast mode Slow mode -- --
Sampling frequency 48 44.1 32
PLL select 16/3 6 8
CORE master Clock (MHz) 98.304 110.592 101.6064 98.304
XRST "L" pulse width(ns) 9/8Tcyc=61.035 1Tcyc=54.253 1Tcyc=59.0514 3/4Tcyc=61.035
8
MB86342B
(2) Crystal Oscillator
1 k
X'tal C1 C2
9
MB86342B
(3) GP0 to 7, D08 to 19, MS, SYSNC, FS1, FS2, PM, PSTOP
EXTIN (1) GP7 to GP0 (lnput) (2) GP7 to GP0 (Output) (3) D19 to D08 (5) MS SYNC FS1, FS2 PM PSTOP BST MOD EXLOCK Valid Valid (4) Valid
Valid
No. (1) (2) (3) (4) (5)
Characteristics GP0 to 7 setup time GP0 to 7 delay time D08 to 19 delay time D08 to 19 hold time Setup time
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit 6 -- -- 2 4 -- -- -- -- -- -- 17 17 -- -- ns ns ns ns ns
10
MB86342B
(4) HCS, HCLK, HDIN, HDOUT
HCS (1) (3) (2)
HCLK (4) (6) (5) (7)
HDIN (8)
Valid (9)
HDOUT
Valid
No. (1) (2) (3) (4) (5) (6) (7) (8) (9)
Characteristics HCS clock active setup time HCS clock active hold time HCLK pulse cycle HCLK "H" pulse width HCLK "L" pulse width HDIN setup time HDIN hold time HDOUT delay time HDOUT hold time
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit 16 16 36 16 16 4 6 -- 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 10 -- ns ns ns ns ns ns ns ns ns
11
MB86342B
(5) LRCKI1, LRCKI2, BCKI2, SDI1, SDI2 (Input Mode)
(1) BCKI1, BCKI2 (lnput) (2) LRCKI1, LRCKI2 (lnput) (4) (3)
Tbck
(5)
SDI1, SDI2
Vallid
No. (1) (2) (3) (4) (5)
Characteristics BCKI1,BCKI2 cycle (Tbck) LRCKI1,LRCKI2 setup time LRCKI1,LRCKI2 hold time SDI1,SDI2 setup time SDI1,SDI2 hold time
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit -- -- -- 3 6 * -- -- -- -- -- 1/4 Tbck 1/4 Tbck -- -- ns ns ns ns ns
* : BCKI1, BCKI2 frequency BCKI1, BCKI2 Tbck (ns) 651.036 325.518 708.6168 354.3084 976.560 488.280
Audio mode setting 32fs 64fs 32fs 64fs 32fs 64fs
EXTIN (MHz) 18.432 16.9344 12.288
12
MB86342B
(6) LRCKI1, BCKI1, LRCKO, BCKO, SDO1 to 3 (Output Mode)
EXTIN (1) BCKI1(Outpput) BCKO (3) LRCKI1(Output) LRCKO (5) (6) (4) (2)
SDOI toSDO3
Vallid
No. (1) (2) (3) (4) (5) (6)
Characteristics BCKI1, BCKO fall delay time BCKI1, BCKO rise delay time LRCKI1, LRCKO fall delay time LRCKI1, LRCKO rise delay time SDO1 to 3 delay time SDO1 to 3 hold time
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit -- -- -- -- -- 0.5 -- -- -- -- -- -- 11 11 5 5 7 -- ns ns ns ns ns ns
13
MB86342B
(7) CS, WE, A00 to 15, D00 to 07 (Data Write)
EXTIN (1) (2)
CS (3) (5)
WE (6) (7) A15 to A00 (9) Valid (10) (4) (8)
D07 to D00
Valid
No. (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) CS delay time CS hold time
Characteristics
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit -- 2 -- 8 2 0.7 -- 2 -- 2 -- -- -- -- -- -- -- -- -- -- 20 -- 22 -- -- -- 20 -- 22 5 ns ns ns ns ns ns ns ns ns ns
WE delay time WE "H" pulse width WE hold time WE setup time A00 to 15 delay time A00 to 15 hold time D00 to 07 delay time D00 to 07 hold time
14
MB86342B
(8) CS, WE, A00 to 15, D00 to 07 (Data Read)
EXTIN (1) (2)
CS
WE (3) (4)
A15 to A00
Valid (5) (6)
D07 to D00
Valid
No. (1) (2) (3) (4) (5) (6) CS delay time CS hold time
Characteristics
( VDD = 3.0 to 3.6V, VSS = 0V, Ta = 0 to +70C) Min. Typ. Max. Unit -- 2 -- 3 3 7 -- -- -- -- -- -- 20 -- 22 -- -- -- ns ns ns ns ns ns
A00 to 15 delay time A00 to 15 hold time D00 to 07 setup time D00 to 07 hold time
15
MB86342B
s SYSTEM CONSTRUCTION
1. Dolby Digital Decoder (5.1 ch)
SRAM(Delay)
D07 to 00 CS LRCK BCK DOUT FSOUT CLK LRCKI2 BCK SDI2 FS1 to 2 KFSIO
WE
A15 to 00 BCKO LRCKO SDO1 SDO2 SDO3 KFSIO BCK LRCK DIN MCK BCK LRCK DIN MCK BCK LRCK DIN MCK AOUT AOUT L R
Digital-in Dolby Digital Bit-stream
AOUT AOUT
LS RS
DIR
MB86342B MB86342 AOUT AOUT C LFE
HCS
HCLK
HDIN
HDOUT
Host CPU
2. Dolby Pro Logic Decoder (4 ch)
SRAM(Delay)
D07 to 00 CS LRCK BCK DOUT FSOUT CLK LRCKI2 BCKI2 SDI2 FS1 to 2 KFSIO
WE
A15 to 00 BCKO LRCKO SDO1 SDO2 SDO3 KFSIO BCK LRCK DIN MCK BCK LRCK DIN MCK BCK LRCK DIN MCK AOUT AOUT L R
Digital-in Dolby Digital Bit-stream
AOUT AOUT
SR SR
ADC
MB86342B AOUT AOUT C
HCS
HCLK
HDIN
HDOUT
Host CPU
16
MB86342B
3. Dolby Digital + Dolby Pro Logic Decoder
SRAM(Delay)
D07 to 00 CS LRCK BCK DOUT FSOUT CLK LRCKI2 BCK SDI2 FS1~2 KFSIO
WE
A15 to 00 BCKO LRCKO SDO1 SDO2 SDO3 KFSIO BCK LRCK DIN MCK BCK LRCK DIN MCK BCK LRCK DIN MCK AOUT AOUT L R
Digital-in Dolby surround Bit-stream
AOUT AOUT
SR SR
DIR
MB86342B MB86342 AOUT AOUT C
HCS
HCLK
HDIN
HDOUT
Host CPU
17
MB86342B
s PACKAGE DIMENSION
100-pin Plastic QFP (FPT-100P-M06)
23.900.40(.941.016)
80 81
3.35(.132)MAX
51 50
20.000.20(.787.008)
0.05(.002)MIN (STAND OFF)
14.000.20 (.551.008)
INDEX
100 31
17.900.40 (.705.016)
12.35(.486) REF
16.300.40 (.642.016)
"A" LEAD No.
1 30
0.65(.0256)TYP
0.300.10 (.012.004)
0.13(.005)
M
0.150.05(.006.002)
Details of "A" part 0.25(.010) "B" 0.10(.004) 18.85(.742)REF 22.300.40(.878.016) 0.30(.012) 0.18(.007)MAX 0.53(.021)MAX 0 10 0.800.20 (.031.008) Details of "B" part
C
1994 FUJITSU LIMITED F100008-3C-2
Dimensions in mm (inch).
18
MB86342B
FUJITSU LIMITED
For further information please contact:
Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka Nakahara-ku, Kawasaki-shi Kanagawa 211-8588, Japan Tel: (044) 754-3763 Fax: (044) 754-3329
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export of those products from Japan.
http://www.fujitsu.co.jp/
North and South America FUJITSU MICROELECTRONICS, INC. Semiconductor Division 3545 North First Street San Jose, CA 95134-1804, USA Tel: (408) 922-9000 Fax: (408) 922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: (800) 866-8608 Fax: (408) 922-9179
http://www.fujitsumicro.com/
Europe FUJITSU MIKROELEKTRONIK GmbH Am Siebenstein 6-10 D-63303 Dreieich-Buchschlag Germany Tel: (06103) 690-0 Fax: (06103) 690-122
http://www.fujitsu-ede.com/
Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan New Tech Park Singapore 556741 Tel: (65) 281-0770 Fax: (65) 281-0220
http://www.fmap.com.sg/
F9802 (c) FUJITSU LIMITED Printed in Japan
20

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